Consumer Tech, Gaming & Mobility, curated by Mike
MediaTek Dimensity and Helio chipsets: 5G, AI, and connected device platforms for global markets.
MediaTek’s Dimensity 9400 lands today, and it’s the Taiwanese fabless giant’s most impressive mobile chip to date. This next-generation processor is built
MediaTek has launched its most powerful mobile chip ever: the Dimensity 9300, and it’s making bold architectural choices that directly challenge Qualcomm’s
MediaTek pulled the curtain back on its next flagship SoC today: the Dimensity 9200. Built on TSMC’s cutting-edge 4nm process, this chip
I will try to be simple for this review and give my opinion with no filter. Build, Specs, Build Quality/DesignUnboxingSpecificationsGolden RatioVideo tourScreen
MediaTek announced the successful implementation of the global software security model Building Security In Maturity Model (BSIMM12), making it the first company in
MediaTek and NEC Platforms, Ltd. today announced the first NEC 5G customer-premise equipment (CPE) and mobile Wi-Fi (Mi-Fi) products powered by MediaTek’s T750 5G chipset. This
The T750 is a highly integrated, 7nm compact chipset design with an integrated 5G radio and quad-core Arm CPU. It’s full-featured with
MediaTek today unveiled its new Filogic connectivity family with the introduction of the Filogic 830 Wi-Fi 6/6E system-on-chip (SoC) and Filogic 630 Wi-Fi