MediaTek Dimensity 9400: TSMC 3nm, 50 TOPS AI, and the Closest Race Yet with Snapdragon
MediaTek’s Dimensity 9400 lands today, and it’s the Taiwanese fabless giant’s most impressive mobile chip to date. Built on TSMC’s cutting-edge 3nm
Category: Mediatek
MediaTek Dimensity and Helio chipsets: 5G, AI, and connected device platforms for global markets.
MediaTek Dimensity 9300: All-Big-Core Architecture Takes the Fight Directly to Snapdragon 8 Gen 3
MediaTek has launched its most powerful mobile chip ever: the Dimensity 9300, and it’s making bold architectural choices that directly challenge Qualcomm’s
MediaTek Dimensity 9200: Ray Tracing and Wi-Fi 7 Come to MediaTek Flagships
MediaTek pulled the curtain back on its next flagship SoC today: the Dimensity 9200. Built on TSMC’s cutting-edge 4nm process, this chip
OPPO Reno 8 Pro 5G: A Flagship in disguise
I will try to be simple for this review and give my opinion with no filter. Build, Specs, Build Quality/DesignUnboxingSpecificationsGolden RatioVideo tourScreen
MediaTek Becomes First Company in Taiwan to Complete Authoritative Global Information Security Assessment BSIMM
MediaTek announced the successful implementation of the global software security model Building Security In Maturity Model (BSIMM12), making it the first company in
MediaTek’s T750 Powers NEC Platforms’ New 5G CPE and Mi-Fi Products to be Launched in Japan
MediaTek and NEC Platforms, Ltd. today announced the first NEC 5G customer-premise equipment (CPE) and mobile Wi-Fi (Mi-Fi) products powered by MediaTek’s T750 5G chipset. This
MediaTek T750
The T750 is a highly integrated, 7nm compact chipset design with an integrated 5G radio and quad-core Arm CPU. It’s full-featured with
MediaTek Announces Filogic Connectivity Family with New Filogic 830 and Filogic 630 Wi-Fi 6/6E Chips
MediaTek today unveiled its new Filogic connectivity family with the introduction of the Filogic 830 Wi-Fi 6/6E system-on-chip (SoC) and Filogic 630 Wi-Fi