MediaTek has launched its most powerful mobile chip ever: the Dimensity 9300, and it’s making bold architectural choices that directly challenge Qualcomm’s Snapdragon 8 Gen 3 for the 2024 flagship crown. Built on TSMC’s 4nm process, the 9300 takes the radical step of adopting an all-big-core CPU architecture — four ARM Cortex-X4 cores and four Cortex-A720 cores, with no small efficiency cores at all.
The performance results are extraordinary: in multi-threaded benchmarks, the Dimensity 9300 outperforms the Snapdragon 8 Gen 3 in several scenarios. Peak CPU performance is remarkable. The trade-off is power consumption under sustained load — the no-efficiency-core design runs hotter, a factor OEMs will need to manage carefully in thermal design.
The APU 790 AI processor delivers up to 35 TOPS of on-device AI performance, enabling real-time LLM inference, AI image generation, and multimodal AI tasks. The Imagiq 990 ISP supports up to 320MP sensors and simultaneous four-camera operation. Wi-Fi 7 and Bluetooth 5.4 round out the connectivity story.
OPPO, vivo, and Xiaomi are all confirmed launch partners. MediaTek is playing for the flagship throne in 2024.
Source: MediaTek Blog