MediaTek’s Dimensity 9400 lands today, and it’s the Taiwanese fabless giant’s most impressive mobile chip to date. Built on TSMC’s cutting-edge 3nm process — a generation ahead of its predecessor — the 9400 delivers extraordinary gains in both performance and efficiency, addressing the primary criticism of the Dimensity 9300’s thermal characteristics.
The new architecture features a prime Cortex-X925 core clocked at 3.62GHz, three Cortex-X925 performance cores, and four efficiency cores — a more balanced design than the 9300’s all-big-core approach. CPU performance is up 35% versus the 9300, while power efficiency improves by 40% in sustained workloads. The Immortalis-G925 GPU brings 41% better graphics performance with hardware ray tracing enabled by default.
On-device AI is the centrepiece: the new APU 890 delivers 50 TOPS of AI compute, enabling multi-billion parameter LLM inference on-device. MediaTek demonstrated running a 7B parameter model locally in real-time — directly competitive with Qualcomm’s Snapdragon 8 Elite demonstrations.
vivo X200 Pro and OPPO Find X8 Pro are the headline launch devices. The 2024 flagship war between Qualcomm and MediaTek has never been closer.
Source: MediaTek Blog