The rumour mills are spinning fast: the Snapdragon 8 Gen 2 is shaping up to be one of the most significant mobile chip upgrades in recent memory. Ahead of the official Snapdragon Summit — now confirmed for mid-November in Hawaii — early benchmark leaks and supply chain reports are painting a compelling picture of what Qualcomm has been cooking.
According to multiple credible sources, the 8 Gen 2 is expected to be fabbed on TSMC’s 4nm process (compared to Samsung’s 4nm on the 8 Gen 1), which could address the overheating and efficiency issues that plagued last year’s flagship chip. Early AnTuTu scores already suggest a 10-15% performance uplift over the 8 Gen 1, with even bigger gains in GPU and AI workloads.
On the connectivity side, the X70 modem is expected to bring Wi-Fi 7 support and improved 5G mmWave efficiency — a meaningful step forward for next-gen network performance. For mobile photography enthusiasts, the new Spectra ISP promises improved computational photography capabilities that could push Android camera systems to new heights.
Samsung, Xiaomi, OPPO, and OnePlus are all expected to be early launch partners. If the performance and thermal improvements deliver on their promise, the Snapdragon 8 Gen 2 could be the chip that finally puts the 8 Gen 1’s rocky reputation to rest.
Source: Qualcomm Blog